Advanced Packaging Module Development Engineer — US, Oregon, Hillsboro

Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. Our Oregon campus in Hillsboro is one of Intel's largest and most strategically important sites globally, serving as a hub for cutting-edge semiconductor research, development, and high-volume manufacturing. At Intel, we believe in the power of human ingenuity and are committed to creating an inclusive, collaborative environment where brilliant minds come together to solve the world's most complex technological challenges.   We are seeking a highly motivated and technically skilled Process Integration Engineer to join our dynamic team in Hillsboro, Oregon. In this critical role, you will be at the intersection of innovation and manufacturing, driving technology development and enablement for both high-volume manufacturing and next-generation semiconductor technologies. You will lead the design and development of sophisticated manufacturing processes, perform pathfinding activities for future device architectures, and collaborate with world-class suppliers and internal teams to push the boundaries of what's possible in semiconductor technology. This is a unique opportunity to make a meaningful impact on Intel's strategic roadmap and the broader semiconductor industry.   Key Responsibilities: • Technology Development & Enablement: Drive technology development for high-volume manufacturing and future technology nodes, providing process integration and equipment solutions to meet desired device specifications. • Process Design & Development: Lead the design and development of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. • Pathfinding & Roadmap Development: Perform pathfinding activities in support of process and hardware development, enabling the manufacturing of innovative device architectures, and develop technology roadmaps for future product generations. • Manufacturing Optimization: Recommend and implement modifications to operating equipment to improve production efficiency, refine manufacturing techniques, and optimize production output for existing products. • Supplier Collaboration: Partner with key equipment and materials suppliers to develop and implement enabling elements of technology, building cost-sensitive roadmaps in collaboration with the vendor ecosystem. • Feasibility Studies: Perform process technology feasibility studies through theoretical simulations and practical engineering methods to validate new approaches and technologies. • Industry Awareness: Remain current on relevant industrial process and material manufacturing technical trends, developing a forward-looking view of Intel's future process technology needs to push the industry forward. • Statistical Analysis & Experimentation: Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions and process improvements. • Automation & Systems Development: Leverage hands-on experience with robotics, automation systems, vision systems, and image processing to advance manufacturing capabilities.   As a Successful Candidate, You Will Bring: • A Natural Problem-Solver: You thrive when faced with complex challenges and approach them with creativity, curiosity, and a structured mindset. • Adaptable & Resilient: You embrace change and ambiguity, pivoting quickly when priorities shift without losing momentum or focus. • A Collaborative Team Player: You build strong relationships across teams, functions, and supplier ecosystems, knowing that the best outcomes come from working together. • An Effective Communicator: You can translate complex technical concepts into clear, actionable insights for diverse audiences, from engineers to leadership. • Self-Motivated & Driven: You take ownership of your work, proactively seek out opportunities to improve processes, and are passionate about making a meaningful impact. • Detail-Oriented: You bring precision and rigor to everything you do, understanding that in semiconductor manufacturing, the smallest details can make the biggest difference. • Innovative & Forward-Thinking: You are passionate about staying ahead of industry trends and are energized by the opportunity to shape the future of semiconductor technology.   Are you ready to be part of a team that is literally building the future? At Intel's Hillsboro, Oregon campus, you'll have the resources, the talent, and the mission to do work that truly matters — not just for Intel, but for the world. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with 4+ years of relevant industry experience; or a PhD degree in the same fields with 3+ years of relevant experience. • Relevant experience will be any of the following: • Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems. • Hands-on experience with robotics, automation systems, vision systems, or image processing.   Preferred Qualifications: • 4+ years of experience in: • Statistical Process Control (SPC) and Design of Experiments (DOE) principles. • Programming experience in Python or MATLAB. • Troubleshoot complex manufacturing processes and equipment. • Packaging processes, equipment automation development, or project management. • Semiconductor device physics and advanced packaging technologies.            Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .     Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD     The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.     Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.